Ship the Chip

Lesson Focus

Lesson focuses on engineering package designs that meet the needs of safely shipping a product. Students work in teams of “engineers” to design a package using standard materials that will safely ship a single chip through the mail to the school address.

Download:

Full Lesson Plan
Student Worksheets

Translated Lessons:

• Arabic
• Chinese
• French
• German
• Japanese
• Russian
• Spanish

Age Levels:

8 – 18

Objectives

• Learn about engineering product planning and design.
• Learn about meeting the needs of society.
• Learn about teamwork and working in groups

Anticipated Learner Outcomes

As a result of this activity, students should develop an understanding of:

• Package design planning and testing
• problem solving
• teamwork

Lesson Activities

Students learn how engineers develop packaging design requirements, and work in a team to evaluate the external stresses that engineers must consider when developing a package or product design. Students develop a plan, select materials, manufacture their package, test it, and evaluate their results. Student teams present their reflections to the class.

Resources/Materials

• Teacher Resource Documents (attached)
• Student Worksheets (attached)
• Student Resource Sheets (attached)

Alignment to Curriculum Frameworks

Curriculum alignment sheet is included in PDF.