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Ship the Chip

Lesson Focus 
Lesson focuses on engineering package designs that meet the needs of safely shipping a product. Students work in teams of "engineers" to design a package using standard materials that will safely ship a single chip through the mail to the school address.

Age Levels:

8 - 18
Objectives 
  • Learn about engineering product planning and design.
  • Learn about meeting the needs of society.
  • Learn about teamwork and working in groups
Anticipated Learner Outcomes 

As a result of this activity, students should develop an understanding of:

  • Package design planning and testing
  • problem solving
  • teamwork
Lesson Activities 

Students learn how engineers develop packaging design requirements, and work in a team to evaluate the external stresses that engineers must consider when developing a package or product design. Students develop a plan, select materials, manufacture their package, test it, and evaluate their results. Student teams present their reflections to the class.

Resources/Materials 
  • Teacher Resource Documents (attached)
  • Student Worksheets (attached)
  • Student Resource Sheets (attached)

Alignment to Curriculum Frameworks

Curriculum alignment sheet is included in PDF.


Alignment to Curriculum Frameworks

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